Founding Editor:

Professor C.L. Tien
University of California at Berkeley

Editors:

G.P. "Bud" Peterson - Office of the Provost, Rensselaer Polytechnic Institute, Troy, NY 12180, USA
Akira Yabe - Research Center for Advanced Manufacturing on Nanoscale Science and Engineering, AIST, 1-2-1, Namiki, Tsukuba Science City, Ibaraki, Japan 305-8564
Gang Chen - Massachusetts Institute of Technology, Cambridge, MA USA
Massoud Kaviany - University of Michigan, Ann Arbor, MI USA
David Cahill - University of Illinois, Urbana, IL USA
Pamela Norris - University of Virginia, Charlottesville, VA USA
Shigeo Maruyama - University of Tokyo, Tokyo, JAPAN
Shigeki Hirasawa - Kobe University, JAPAN
Joon Sik Lee - School of Mechanical & Aerospace Engineering, Seoul National University, South Korea
Xin-gang Liang - Tsinghua University, Beijing, CHINA
Hsin-Chen Chu - National Chiao Tung University, Hsin Chu TAIWAN
Dimos Poulikakos - Swiss Federal Institute of Technology, Zurich, SWITZERLAND
Jean-Jacques Greffet - Le'Ecole Centrale, Paris / CNRS, FRANCE
Gian Piero Celata - ENEA National Institute of Thermal-Fluid Dynamics, Rome ITALY
Thomas Thundat - Molecular Imaging Group, Oak Ridge National Laboratory, Oak Ridge, TN USA

Editorial Advisory Board:

Richard O. Buckius - University of Illinois at Urbana-Champaign, Urbana, IL, USA
Zeng-Yuan Guo - Tsinghua University, Beijing, China
Alexander Ivanovich Leontiev - Russian Academy of Sciences, Moscow, Russia
Kaigham Gabriel - Carnegie Mellon University, Pittsburgh, PA, USA
Akiro Nagashima - Keio University, Tokyo, Japan
Shigeki Hirasawa - Hitachi, Ltd., Ibaraki, Japan
Toshiro Makino - Kyoto University, Kyoto, Japan
Markus I. Flik - Behr GmbH & Company, Stuttgart, Germany
Frank P. Incropera - University of Notre Dame, South Bend, IN, USA
Vishwanath Prasad - Florida International University, Miami, FL, USA